Curable composition, method of preparing curable composition, cured material of curable composition, method of preparing cured material, and electronic device including cured material
A curable composition for an electronic device, includes a curable material; and an oxide-containing complex; wherein the oxide-containing complex includes i) an oxide core and ii) an organic group chemically bound to an atom on a surface of the oxide core, the organic group includes a) a curable gr...
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| creator | Park, Yoongook Son, Intae Son, Younghye Byun, Hoyun Lee, Sanggu Lee, Junhyup Kim, Onnuri |
| description | A curable composition for an electronic device, includes a curable material; and an oxide-containing complex; wherein the oxide-containing complex includes i) an oxide core and ii) an organic group chemically bound to an atom on a surface of the oxide core, the organic group includes a) a curable group reactable with the curable material and b) a linking group linking the atom on a surface of the oxide core to the curable group, and the oxide core includes an aluminum oxide, a silicon oxide, or a combination thereof. |
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Son, Intae ; Son, Younghye ; Byun, Hoyun ; Lee, Sanggu ; Lee, Junhyup ; Kim, Onnuri</creatorcontrib><description>A curable composition for an electronic device, includes a curable material; and an oxide-containing complex; wherein the oxide-containing complex includes i) an oxide core and ii) an organic group chemically bound to an atom on a surface of the oxide core, the organic group includes a) a curable group reactable with the curable material and b) a linking group linking the atom on a surface of the oxide core to the curable group, and the oxide core includes an aluminum oxide, a silicon oxide, or a combination thereof.</description><language>eng</language><subject>ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM ; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; 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and an oxide-containing complex; wherein the oxide-containing complex includes i) an oxide core and ii) an organic group chemically bound to an atom on a surface of the oxide core, the organic group includes a) a curable group reactable with the curable material and b) a linking group linking the atom on a surface of the oxide core to the curable group, and the oxide core includes an aluminum oxide, a silicon oxide, or a combination thereof.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON DYES GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES WORKING-UP |
| title | Curable composition, method of preparing curable composition, cured material of curable composition, method of preparing cured material, and electronic device including cured material |
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