Method of forming semiconductor device including deep vias

A method of manufacturing a semiconductor device includes forming via structures in a first via layer over a transistor layer, the forming the via structures in the first via layer including forming a first via structure in the first via layer, the first via structure being included in a first deep...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Chen, Chien-Ying, Guo, Ta-Pen, Lu, Lee-Chung, Tien, Li-Chun
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PHYSICS SEMICONDUCTOR DEVICES
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