Angled etch for surface smoothing

Methods of processing a feature on a semiconductor workpiece are disclosed. The method is performed after features have been created on the workpiece. An etching species may be directed toward the workpiece at a non-zero tilt angle. In certain embodiments, the tilt angle may be 30° or more. Further,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Liang, Shurong, Andersen, Tassie
Format: Patent
Sprache:eng
Schlagworte:
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