Semiconductor device and method of manufacturing the same

An imaging device includes a first semiconductor element including at least one bump pad that has a concave shape. The at least one bump pad includes a first metal layer and a second metal layer on the first metal layer. The imaging device includes a second semiconductor element including at least o...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Wakiyama, Satoru, Jyo, Naoki, Nakamura, Takuya, Hayashi, Toshihiko, Shimizu, Kan
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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