Semiconductor devices with package-level configurability

A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, and a second contact pad electrically coupled to a second circuit on the die...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Yin, Zhiping, Duesman, Kevin G, Davis, James E, Pusey, John B
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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