Electromagnetic interference shielding in recesses of electronic modules

An electronic module having at least two electronic components mounted on a substrate. The electronic components are covered by a dielectric material. The dielectric material has a recess between adjacent electronic components. The surface of the recess facing at least one electronic component is co...

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Hauptverfasser: Ulland, Holger, Stadnik, Alan Paul, Behl, Susanne
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creator Ulland, Holger
Stadnik, Alan Paul
Behl, Susanne
description An electronic module having at least two electronic components mounted on a substrate. The electronic components are covered by a dielectric material. The dielectric material has a recess between adjacent electronic components. The surface of the recess facing at least one electronic component is coated with a conductive layer while the opposite surface to that coated recess surface is substantially free of a conductive layer. Also disclosed is a process for making the above-specified electronic module.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11844200B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11844200B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11844200B23</originalsourceid><addsrcrecordid>eNrjZPBwzUlNLinKz01Mz0styUxWyMwrSS1KSy1KzUtOVSjOyEzNScnMSwcKKxSlJqcWF6cWK-SnKaRCdOUBNeTmp5TmpBbzMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5FSgBfGhwYaGFiYmRgYGTkbGxKgBAAcHNRw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electromagnetic interference shielding in recesses of electronic modules</title><source>esp@cenet</source><creator>Ulland, Holger ; Stadnik, Alan Paul ; Behl, Susanne</creator><creatorcontrib>Ulland, Holger ; Stadnik, Alan Paul ; Behl, Susanne</creatorcontrib><description>An electronic module having at least two electronic components mounted on a substrate. The electronic components are covered by a dielectric material. The dielectric material has a recess between adjacent electronic components. The surface of the recess facing at least one electronic component is coated with a conductive layer while the opposite surface to that coated recess surface is substantially free of a conductive layer. Also disclosed is a process for making the above-specified electronic module.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231212&amp;DB=EPODOC&amp;CC=US&amp;NR=11844200B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231212&amp;DB=EPODOC&amp;CC=US&amp;NR=11844200B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Ulland, Holger</creatorcontrib><creatorcontrib>Stadnik, Alan Paul</creatorcontrib><creatorcontrib>Behl, Susanne</creatorcontrib><title>Electromagnetic interference shielding in recesses of electronic modules</title><description>An electronic module having at least two electronic components mounted on a substrate. The electronic components are covered by a dielectric material. The dielectric material has a recess between adjacent electronic components. The surface of the recess facing at least one electronic component is coated with a conductive layer while the opposite surface to that coated recess surface is substantially free of a conductive layer. Also disclosed is a process for making the above-specified electronic module.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPBwzUlNLinKz01Mz0styUxWyMwrSS1KSy1KzUtOVSjOyEzNScnMSwcKKxSlJqcWF6cWK-SnKaRCdOUBNeTmp5TmpBbzMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5FSgBfGhwYaGFiYmRgYGTkbGxKgBAAcHNRw</recordid><startdate>20231212</startdate><enddate>20231212</enddate><creator>Ulland, Holger</creator><creator>Stadnik, Alan Paul</creator><creator>Behl, Susanne</creator><scope>EVB</scope></search><sort><creationdate>20231212</creationdate><title>Electromagnetic interference shielding in recesses of electronic modules</title><author>Ulland, Holger ; Stadnik, Alan Paul ; Behl, Susanne</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11844200B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Ulland, Holger</creatorcontrib><creatorcontrib>Stadnik, Alan Paul</creatorcontrib><creatorcontrib>Behl, Susanne</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ulland, Holger</au><au>Stadnik, Alan Paul</au><au>Behl, Susanne</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electromagnetic interference shielding in recesses of electronic modules</title><date>2023-12-12</date><risdate>2023</risdate><abstract>An electronic module having at least two electronic components mounted on a substrate. The electronic components are covered by a dielectric material. The dielectric material has a recess between adjacent electronic components. The surface of the recess facing at least one electronic component is coated with a conductive layer while the opposite surface to that coated recess surface is substantially free of a conductive layer. Also disclosed is a process for making the above-specified electronic module.</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Electromagnetic interference shielding in recesses of electronic modules
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-10T02%3A55%3A22IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Ulland,%20Holger&rft.date=2023-12-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11844200B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true