Amplifier modules and systems with ground terminals adjacent to power amplifier die

An amplifier module includes a module substrate with a mounting surface, a signal conducting layer, a ground layer, and a ground terminal pad at the mounting surface. A thermal dissipation structure extends through the module substrate. A ground contact of a power transistor die is coupled to a surf...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Jones, Jeffrey Kevin, Kim, Kevin, Khalil, Ibrahim, van Straten, Freek Egbert
Format: Patent
Sprache:eng
Schlagworte:
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