Chiplet gearbox for low-cost multi-chip module applications

Semiconductor devices, packaging architectures and associated methods are disclosed. In one embodiment, a multi-chip module (MCM) is disclosed. The MCM includes a first integrated circuit (IC) chip including a first interface defining a first number of interface contacts. Conversion circuitry receiv...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Farjadrad, Ramin
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRONIC CIRCUITRY CALCULATING CODE CONVERSION IN GENERAL CODING COMPUTING COUNTING DECODING ELECTRIC DIGITAL DATA PROCESSING ELECTRICITY PHYSICS
Online-Zugang:	Volltext bestellen
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