Light emitting device package
A light emitting device package including a package body comprising a first opening; a light emitting device disposed in the first opening and including a first bonding part and a second bonding part; a first conductor disposed below the first bonding part; and a second conductor disposed below the...
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creator | Song, June O Lim, Chang Man Kim, Ki Seok |
description | A light emitting device package including a package body comprising a first opening; a light emitting device disposed in the first opening and including a first bonding part and a second bonding part; a first conductor disposed below the first bonding part; and a second conductor disposed below the second bonding part. Further, the first conductor is electrically connected to the first bonding part, and the second conductor is electrically connected to the second bonding part. |
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Further, the first conductor is electrically connected to the first bonding part, and the second conductor is electrically connected to the second bonding part.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD1yUzPKFFIzc0sKcnMS1dISS3LTE5VKEhMzk5MT-VhYE1LzClO5YXS3AyKbq4hzh66qQX58anFQFWpeakl8aHBhoYWxuam5gZORsbEqAEAw88kLQ</recordid><startdate>20231205</startdate><enddate>20231205</enddate><creator>Song, June O</creator><creator>Lim, Chang Man</creator><creator>Kim, Ki Seok</creator><scope>EVB</scope></search><sort><creationdate>20231205</creationdate><title>Light emitting device package</title><author>Song, June O ; Lim, Chang Man ; Kim, Ki Seok</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11837570B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Song, June O</creatorcontrib><creatorcontrib>Lim, Chang Man</creatorcontrib><creatorcontrib>Kim, Ki Seok</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Song, June O</au><au>Lim, Chang Man</au><au>Kim, Ki Seok</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Light emitting device package</title><date>2023-12-05</date><risdate>2023</risdate><abstract>A light emitting device package including a package body comprising a first opening; a light emitting device disposed in the first opening and including a first bonding part and a second bonding part; a first conductor disposed below the first bonding part; and a second conductor disposed below the second bonding part. Further, the first conductor is electrically connected to the first bonding part, and the second conductor is electrically connected to the second bonding part.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Light emitting device package |
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