Leadframe with delamination resistant feature

Leadframe with delamination resistant feature

A packaged semiconductor device includes a semiconductor die having a top side including a semiconductor surface layer having circuitry configured for a function coupled to bond pads, and a bottom side. A leadframe includes a die pad and leads or lead terminals on at least two sides of the die pad....

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Hauptverfasser: Bin Hud, Amirul Afiq, Bin Herman, Adi Irwan, Lim, Sueann Wei Fen
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Bin Hud, Amirul Afiq
Bin Herman, Adi Irwan
Lim, Sueann Wei Fen
description A packaged semiconductor device includes a semiconductor die having a top side including a semiconductor surface layer having circuitry configured for a function coupled to bond pads, and a bottom side. A leadframe includes a die pad and leads or lead terminals on at least two sides of the die pad. At least one non-through hole for delamination prevention is in at least one of the die pad and the lead or the lead terminals. The semiconductor die is mounted by a die attach material with the bottom side down on the die pad. A mold compound provides encapsulation for the package semiconductor device except for at least a bottom side of the lead terminals or sidewalls of the package for the leads. The non-through hole is a filled hole filled with either the die attach material or the mold compound.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Leadframe with delamination resistant feature
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