Harsh and hazardous location light-emitting diode module, luminaire assembly, and method

A light-emitting diode (LED) module of an LED luminaire assembly for a harsh and hazardous environment is provided. The LED module includes an LED assembly, a single-piece lens assembly, and an adhesive sealant. The LED assembly includes a plurality of LEDs. The single-piece lens assembly includes a...

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Bibliographische Detailangaben
Hauptverfasser:	Yang, Yang, Liu, Peihuan, Li, Yuru
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING LIGHT SOURCES NOT OTHERWISE PROVIDED FOR LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS LIGHTING MECHANICAL ENGINEERING NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS
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Beschreibung
Zusammenfassung:	A light-emitting diode (LED) module of an LED luminaire assembly for a harsh and hazardous environment is provided. The LED module includes an LED assembly, a single-piece lens assembly, and an adhesive sealant. The LED assembly includes a plurality of LEDs. The single-piece lens assembly includes a plurality of lenses, wherein the lens assembly includes a groove defining a complete loop and surrounding the plurality of lenses, the lens assembly coupled to the LED assembly, and the plurality of lenses covering at least one of the plurality of LEDs. The adhesive sealant is disposed in the groove and bonded to the lens assembly, the adhesive sealant sealing off the plurality of LEDs from an ambient environment around the LED module.