Photosensitive resin composition and use thereof
The present disclosure discloses a photosensitive resin composition and a use the same. The resin composition of the present disclosure includes 40-70 parts by weight of an alkali-soluble resin, 20-50 parts by weight of a photopolymerizable monomer, 0.5-10.0 parts by weight of a photoinitiator, and...
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creator | Li, Weijie Zhou, Guangda Tong, Rongbai Qian, Weiqiang Zhu, Gaohua Lin, Jianhua |
description | The present disclosure discloses a photosensitive resin composition and a use the same. The resin composition of the present disclosure includes 40-70 parts by weight of an alkali-soluble resin, 20-50 parts by weight of a photopolymerizable monomer, 0.5-10.0 parts by weight of a photoinitiator, and 0.1-10.0 parts by weight of additives. The photopolymerizable monomer includes 0.5-15.0 parts by weight of a monomer containing carbonate structure. The photosensitive resin composition is used as a dry film resist. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11827781B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11827781B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11827781B23</originalsourceid><addsrcrecordid>eNrjZDAIyMgvyS9OzSvOLMksS1UoSi3OzFNIzs8tyAeJ5OcpJOalKJQWpyqUZKQWpean8TCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSS-NBgQ0MLI3NzC0MnI2Ni1AAAsI0sFw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Photosensitive resin composition and use thereof</title><source>esp@cenet</source><creator>Li, Weijie ; Zhou, Guangda ; Tong, Rongbai ; Qian, Weiqiang ; Zhu, Gaohua ; Lin, Jianhua</creator><creatorcontrib>Li, Weijie ; Zhou, Guangda ; Tong, Rongbai ; Qian, Weiqiang ; Zhu, Gaohua ; Lin, Jianhua</creatorcontrib><description>The present disclosure discloses a photosensitive resin composition and a use the same. The resin composition of the present disclosure includes 40-70 parts by weight of an alkali-soluble resin, 20-50 parts by weight of a photopolymerizable monomer, 0.5-10.0 parts by weight of a photoinitiator, and 0.1-10.0 parts by weight of additives. The photopolymerizable monomer includes 0.5-15.0 parts by weight of a monomer containing carbonate structure. The photosensitive resin composition is used as a dry film resist.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTROGRAPHY ; HOLOGRAPHY ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MATERIALS THEREFOR ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231128&DB=EPODOC&CC=US&NR=11827781B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231128&DB=EPODOC&CC=US&NR=11827781B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Li, Weijie</creatorcontrib><creatorcontrib>Zhou, Guangda</creatorcontrib><creatorcontrib>Tong, Rongbai</creatorcontrib><creatorcontrib>Qian, Weiqiang</creatorcontrib><creatorcontrib>Zhu, Gaohua</creatorcontrib><creatorcontrib>Lin, Jianhua</creatorcontrib><title>Photosensitive resin composition and use thereof</title><description>The present disclosure discloses a photosensitive resin composition and a use the same. The resin composition of the present disclosure includes 40-70 parts by weight of an alkali-soluble resin, 20-50 parts by weight of a photopolymerizable monomer, 0.5-10.0 parts by weight of a photoinitiator, and 0.1-10.0 parts by weight of additives. The photopolymerizable monomer includes 0.5-15.0 parts by weight of a monomer containing carbonate structure. The photosensitive resin composition is used as a dry film resist.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAIyMgvyS9OzSvOLMksS1UoSi3OzFNIzs8tyAeJ5OcpJOalKJQWpyqUZKQWpean8TCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSS-NBgQ0MLI3NzC0MnI2Ni1AAAsI0sFw</recordid><startdate>20231128</startdate><enddate>20231128</enddate><creator>Li, Weijie</creator><creator>Zhou, Guangda</creator><creator>Tong, Rongbai</creator><creator>Qian, Weiqiang</creator><creator>Zhu, Gaohua</creator><creator>Lin, Jianhua</creator><scope>EVB</scope></search><sort><creationdate>20231128</creationdate><title>Photosensitive resin composition and use thereof</title><author>Li, Weijie ; Zhou, Guangda ; Tong, Rongbai ; Qian, Weiqiang ; Zhu, Gaohua ; Lin, Jianhua</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11827781B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>Li, Weijie</creatorcontrib><creatorcontrib>Zhou, Guangda</creatorcontrib><creatorcontrib>Tong, Rongbai</creatorcontrib><creatorcontrib>Qian, Weiqiang</creatorcontrib><creatorcontrib>Zhu, Gaohua</creatorcontrib><creatorcontrib>Lin, Jianhua</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Li, Weijie</au><au>Zhou, Guangda</au><au>Tong, Rongbai</au><au>Qian, Weiqiang</au><au>Zhu, Gaohua</au><au>Lin, Jianhua</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Photosensitive resin composition and use thereof</title><date>2023-11-28</date><risdate>2023</risdate><abstract>The present disclosure discloses a photosensitive resin composition and a use the same. The resin composition of the present disclosure includes 40-70 parts by weight of an alkali-soluble resin, 20-50 parts by weight of a photopolymerizable monomer, 0.5-10.0 parts by weight of a photoinitiator, and 0.1-10.0 parts by weight of additives. The photopolymerizable monomer includes 0.5-15.0 parts by weight of a monomer containing carbonate structure. The photosensitive resin composition is used as a dry film resist.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP |
title | Photosensitive resin composition and use thereof |
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