Method for filling a space in a semiconductor

A method for partially filling a space between two superimposed structures in a semiconductor device under construction is provided. The method includes the steps of: (a) providing the two superimposed structures having said space therebetween; (b) entirely filling said space with a thermoplastic ma...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Tao, Zheng, Li, Waikin, Chan, Boon Teik
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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