System and method for radical and thermal processing of substrates

The present disclosure provides systems and methods for processing channel structures of substrates that include positioning the substrate in a first processing chamber having a first processing volume. The substrate includes a channel structure with high aspect ratio features having aspect ratios g...

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Bibliographische Detailangaben
Hauptverfasser: Sharma, Shashank, Spuller, Matthew, Zhang, Xinming, Mayur, Abhilash J, Tam, Norman L
Format: Patent
Sprache:eng
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