Sputtering target

A sputtering target having a unitary body. The unitary body includes a planar substrate plate and a toroidal portion extending from a top surface of the substrate plate. The toroidal portion reduces non-uniform erosion against the plate caused by a magnetic field applied to the target. In use, the m...

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Bibliographische Detailangaben
Hauptverfasser:	Bansah, Christopher Yaw, Oder, Tom Nelson, Solomon, Constantin Virgil
Format:	Patent
Sprache:	eng
Schlagworte:	ADDITIVE MANUFACTURING TECHNOLOGY ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PERFORMING OPERATIONS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	A sputtering target having a unitary body. The unitary body includes a planar substrate plate and a toroidal portion extending from a top surface of the substrate plate. The toroidal portion reduces non-uniform erosion against the plate caused by a magnetic field applied to the target. In use, the magnetic field is initially received at the toroidal portion. After the magnetic field wears down the toroidal portion, the magnetic field is received at the substrate plate.