Texturing for high density pixelated-LED chips and chip array devices

Texturing for high density pixelated-LED chips and chip array devices

A pixelated-LED chip includes an active layer with active layer portions, segregated by streets, that are configured to illuminate different light-transmissive substrate portions to form pixels. A light extraction surface of each substrate portion includes protruding features and light extraction su...

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1. Verfasser: Andrews, Peter Scott
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Andrews, Peter Scott
description A pixelated-LED chip includes an active layer with active layer portions, segregated by streets, that are configured to illuminate different light-transmissive substrate portions to form pixels. A light extraction surface of each substrate portion includes protruding features and light extraction surface recesses that may be formed by sawing. Underfill material may be provided between a pixelated-LED chip and a mounting surface, as well as between pixels and between anodes and cathodes thereof. Certain implementations provide light extraction surface recesses that are non-parallel to each street defined through the active layer. Certain implementations provide light extraction surface recesses that are non-aligned with (e.g., non-parallel to) anode-cathode boundaries of each anode-cathode pair. Such arrangements reduce a likelihood of cracking in portions of a pixelated-LED chip. Methods for fabricating pixelated-LED chips are also provided.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Texturing for high density pixelated-LED chips and chip array devices
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