Electrical interconnect structure using metal bridges to interconnect die

A multichip module comprises a carrier, a plurality of chips, an electrical insulating layer, and an electrical interconnect structure. The carrier includes a bottom wall and four side walls defining an internal cavity. The chips are positioned in the internal cavity, with each chip including a plur...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Sedlock, Steven James, Ledden, Kevin Christopher, Young, Barbara Diane, Elliot, Alan Ahlberg
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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