Temporary removable module lid

An electronic module assembly is provided. The electronic module assembly may include one or more processors mounted to a laminate, a top frame mounted to the laminate and surrounding the one or more processors, and a removable lid covering the one or more processors. The removable lid includes latc...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Brodsky, William L, Singer, Noah, Canfield, Shawn, Yu, Yuet-Ying, Zitz, Jeffrey Allen, Torok, John, Schultz, Mark D
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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