Semiconductor devices comprising electrical redistribution layer along with ground line and signal line and methods for manufacturing thereof

Semiconductor devices comprising electrical redistribution layer along with ground line and signal line and methods for manufacturing thereof

A semiconductor device includes a semiconductor chip including an electrical contact arranged on a main surface of the semiconductor chip, an external connection element configured to provide a first electrical connection between the semiconductor device and a printed circuit board, and an electrica...

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Hauptverfasser: Fiore, Vincenzo, Roni, Arif, Stavagna, Emanuele, Hartner, Walter, Kollmann, Helmut, Erdoel, Tuncay, Arcioni, Francesca, Wagner, Christoph
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Fiore, Vincenzo
Roni, Arif
Stavagna, Emanuele
Hartner, Walter
Kollmann, Helmut
Erdoel, Tuncay
Arcioni, Francesca
Wagner, Christoph
description A semiconductor device includes a semiconductor chip including an electrical contact arranged on a main surface of the semiconductor chip, an external connection element configured to provide a first electrical connection between the semiconductor device and a printed circuit board, and an electrical redistribution layer extending in a direction parallel to the main surface of the semiconductor chip and configured to provide a second electrical connection between the electrical contact of the semiconductor chip and the external connection element. The electrical redistribution layer includes a ground line connected to a ground potential and a signal line configured to carry an electrical signal having a wavelength.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor devices comprising electrical redistribution layer along with ground line and signal line and methods for manufacturing thereof
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