Semiconductor device including via structures with undercut portions and semiconductor package including the same

A semiconductor device includes a semiconductor substrate having an active surface on which semiconductor elements are provided. An interlayer insulating film is provided on the semiconductor substrate. A first via structure passes through the semiconductor substrate. The first via structure has a f...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Park, Kwangwuk, Lee, Hakseung, Park, Sangjun, Lee, Daesuk, Cho, Sungdong, Kim, Eunji
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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