Bonding system and bonding method

A bonding system includes a supporting jig having a mounting surface on bonding substrates which are mounted, a bonding device that sandwiches and welds the bonding substrates between itself and the mounting surface, an articulated robot to which the bonding device is attached, and a control unit th...

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Bibliographische Detailangaben
Hauptverfasser:	Yamamori, Yoshinori, Iwano, Yoshihiro, Mori, Takayuki, Hirawaki, Satoshi, Yuchi, Hiroshi, Amaoka, Kazuaki, Furuyashiki, Kenji
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A bonding system includes a supporting jig having a mounting surface on bonding substrates which are mounted, a bonding device that sandwiches and welds the bonding substrates between itself and the mounting surface, an articulated robot to which the bonding device is attached, and a control unit that controls the articulated robot and the bonding device.