Package comprising integrated devices coupled through a metallization layer

A package comprising a first integrated device comprising a plurality of first pillar interconnects; an encapsulation layer at least partially encapsulating the first integrated device; a metallization portion located over the first integrated device and the encapsulation layer, wherein the metalliz...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Stone, William, Weng, Li-Sheng, Xu, Jianwen, Paynter, Charles David, Lane, Ryan
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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