Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate

A die interconnect substrate comprises a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die. The die interconnect substrate comprises a multilayer substrate structure comprising a substrate interconn...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	May, Robert Alan, Darmawikarta, Kristof, Boyapati, Sri Ranga Sai Sai
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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