Configuring signal devices in thermal processing systems

In some aspects, material processing head can include a body; an antenna disposed within the body; a first tag, associated with a first consumable component, disposed within a flux communication zone of the body at a first distance from the antenna, the first tag having a first resonant frequency; a...

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Hauptverfasser: Shipulski, E. Michael, Hoffa, Michael
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Hoffa, Michael
description In some aspects, material processing head can include a body; an antenna disposed within the body; a first tag, associated with a first consumable component, disposed within a flux communication zone of the body at a first distance from the antenna, the first tag having a first resonant frequency; and a second tag, associated with a second consumable component, disposed within the flux communication zone of the body at a second distance from the antenna, the second tag having a second resonant frequency that is different than the first resonant frequency, where the first and second resonant frequencies are tuned based upon at least one of: i) a difference between the first distance and the second distance; or ii) a characteristic (e.g., shape) of the flux communication zone in which the first tag and/or the second tag is disposed.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11783138B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11783138B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11783138B23</originalsourceid><addsrcrecordid>eNrjZLBwzs9Ly0wvLcrMS1cozkzPS8xRSEkty0xOLVbIzFMoyUgtygUKFRTlA0WKwYoqi0tSc4t5GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqcUFicmpeakl8aLChobmFsaGxhZORMTFqAEj_Lwg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Configuring signal devices in thermal processing systems</title><source>esp@cenet</source><creator>Shipulski, E. Michael ; Hoffa, Michael</creator><creatorcontrib>Shipulski, E. Michael ; Hoffa, Michael</creatorcontrib><description>In some aspects, material processing head can include a body; an antenna disposed within the body; a first tag, associated with a first consumable component, disposed within a flux communication zone of the body at a first distance from the antenna, the first tag having a first resonant frequency; and a second tag, associated with a second consumable component, disposed within the flux communication zone of the body at a second distance from the antenna, the second tag having a second resonant frequency that is different than the first resonant frequency, where the first and second resonant frequencies are tuned based upon at least one of: i) a difference between the first distance and the second distance; or ii) a characteristic (e.g., shape) of the flux communication zone in which the first tag and/or the second tag is disposed.</description><language>eng</language><subject>ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL ; CALCULATING ; CLADDING OR PLATING BY SOLDERING OR WELDING ; COMPUTING ; CONTROL OR REGULATING SYSTEMS IN GENERAL ; CONTROLLING ; COUNTING ; CUTTING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; CUTTING-OUT ; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS ; GRINDING ; HAND CUTTING TOOLS ; HANDLING RECORD CARRIERS ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS ; PERFORATING ; PERFORMING OPERATIONS ; PHYSICS ; PLASMA TECHNIQUE ; POLISHING ; PRESENTATION OF DATA ; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS ; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS ; PUNCHING ; RECOGNITION OF DATA ; RECORD CARRIERS ; REGULATING ; SEVERING ; SEVERING BY MEANS OTHER THAN CUTTING ; SOLDERING OR UNSOLDERING ; STAMPING-OUT ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231010&amp;DB=EPODOC&amp;CC=US&amp;NR=11783138B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231010&amp;DB=EPODOC&amp;CC=US&amp;NR=11783138B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Shipulski, E. Michael</creatorcontrib><creatorcontrib>Hoffa, Michael</creatorcontrib><title>Configuring signal devices in thermal processing systems</title><description>In some aspects, material processing head can include a body; an antenna disposed within the body; a first tag, associated with a first consumable component, disposed within a flux communication zone of the body at a first distance from the antenna, the first tag having a first resonant frequency; and a second tag, associated with a second consumable component, disposed within the flux communication zone of the body at a second distance from the antenna, the second tag having a second resonant frequency that is different than the first resonant frequency, where the first and second resonant frequencies are tuned based upon at least one of: i) a difference between the first distance and the second distance; or ii) a characteristic (e.g., shape) of the flux communication zone in which the first tag and/or the second tag is disposed.</description><subject>ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL</subject><subject>CALCULATING</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>COMPUTING</subject><subject>CONTROL OR REGULATING SYSTEMS IN GENERAL</subject><subject>CONTROLLING</subject><subject>COUNTING</subject><subject>CUTTING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>CUTTING-OUT</subject><subject>DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FUNCTIONAL ELEMENTS OF SUCH SYSTEMS</subject><subject>GRINDING</subject><subject>HAND CUTTING TOOLS</subject><subject>HANDLING RECORD CARRIERS</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS</subject><subject>PERFORATING</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>PLASMA TECHNIQUE</subject><subject>POLISHING</subject><subject>PRESENTATION OF DATA</subject><subject>PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS</subject><subject>PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS</subject><subject>PUNCHING</subject><subject>RECOGNITION OF DATA</subject><subject>RECORD CARRIERS</subject><subject>REGULATING</subject><subject>SEVERING</subject><subject>SEVERING BY MEANS OTHER THAN CUTTING</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>STAMPING-OUT</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBwzs9Ly0wvLcrMS1cozkzPS8xRSEkty0xOLVbIzFMoyUgtygUKFRTlA0WKwYoqi0tSc4t5GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqcUFicmpeakl8aLChobmFsaGxhZORMTFqAEj_Lwg</recordid><startdate>20231010</startdate><enddate>20231010</enddate><creator>Shipulski, E. Michael</creator><creator>Hoffa, Michael</creator><scope>EVB</scope></search><sort><creationdate>20231010</creationdate><title>Configuring signal devices in thermal processing systems</title><author>Shipulski, E. Michael ; Hoffa, Michael</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11783138B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL</topic><topic>CALCULATING</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>COMPUTING</topic><topic>CONTROL OR REGULATING SYSTEMS IN GENERAL</topic><topic>CONTROLLING</topic><topic>COUNTING</topic><topic>CUTTING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>CUTTING-OUT</topic><topic>DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FUNCTIONAL ELEMENTS OF SUCH SYSTEMS</topic><topic>GRINDING</topic><topic>HAND CUTTING TOOLS</topic><topic>HANDLING RECORD CARRIERS</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS</topic><topic>PERFORATING</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>PLASMA TECHNIQUE</topic><topic>POLISHING</topic><topic>PRESENTATION OF DATA</topic><topic>PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS</topic><topic>PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS</topic><topic>PUNCHING</topic><topic>RECOGNITION OF DATA</topic><topic>RECORD CARRIERS</topic><topic>REGULATING</topic><topic>SEVERING</topic><topic>SEVERING BY MEANS OTHER THAN CUTTING</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>STAMPING-OUT</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>Shipulski, E. Michael</creatorcontrib><creatorcontrib>Hoffa, Michael</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Shipulski, E. Michael</au><au>Hoffa, Michael</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Configuring signal devices in thermal processing systems</title><date>2023-10-10</date><risdate>2023</risdate><abstract>In some aspects, material processing head can include a body; an antenna disposed within the body; a first tag, associated with a first consumable component, disposed within a flux communication zone of the body at a first distance from the antenna, the first tag having a first resonant frequency; and a second tag, associated with a second consumable component, disposed within the flux communication zone of the body at a second distance from the antenna, the second tag having a second resonant frequency that is different than the first resonant frequency, where the first and second resonant frequencies are tuned based upon at least one of: i) a difference between the first distance and the second distance; or ii) a characteristic (e.g., shape) of the flux communication zone in which the first tag and/or the second tag is disposed.</abstract><oa>free_for_read</oa></addata></record>
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subjects ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
CALCULATING
CLADDING OR PLATING BY SOLDERING OR WELDING
COMPUTING
CONTROL OR REGULATING SYSTEMS IN GENERAL
CONTROLLING
COUNTING
CUTTING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
CUTTING-OUT
DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FUNCTIONAL ELEMENTS OF SUCH SYSTEMS
GRINDING
HAND CUTTING TOOLS
HANDLING RECORD CARRIERS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS
PERFORATING
PERFORMING OPERATIONS
PHYSICS
PLASMA TECHNIQUE
POLISHING
PRESENTATION OF DATA
PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS
PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS
PUNCHING
RECOGNITION OF DATA
RECORD CARRIERS
REGULATING
SEVERING
SEVERING BY MEANS OTHER THAN CUTTING
SOLDERING OR UNSOLDERING
STAMPING-OUT
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title Configuring signal devices in thermal processing systems
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-07T16%3A53%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Shipulski,%20E.%20Michael&rft.date=2023-10-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11783138B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true