Polymeric substrate including a barrier layer

A polymeric substrate is disclosed. The polymeric substrate comprises a barrier layer including a polymeric material comprising about 50 wt. % or more of at least one polyolefin polymer and 50 wt. % or less of a hydrocarbon resin. The polymeric material exhibits a DTUL of 30° C. or more and a tensil...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Mahan, Ross Michael, Bodiford, Billy R
Format: Patent
Sprache:eng
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