Semiconductor device and manufacturing method thereof

A method includes forming a gate structure on a substrate; forming a gate spacer on a sidewall of the gate structure; forming a carbon-containing layer on the gate spacer; diffusing carbon from the carbon-containing layer into a portion of the substrate below the gate spacer; forming a recess in the...

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Hauptverfasser: Li, Chung-Ting, Li, Hou-Ju, Lin, Yu-Chang, Chen, Hung-Ming, Lu, Jen-Hsiang, Tsao, Chih-Pin
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creator Li, Chung-Ting
Li, Hou-Ju
Lin, Yu-Chang
Chen, Hung-Ming
Lu, Jen-Hsiang
Tsao, Chih-Pin
description A method includes forming a gate structure on a substrate; forming a gate spacer on a sidewall of the gate structure; forming a carbon-containing layer on the gate spacer; diffusing carbon from the carbon-containing layer into a portion of the substrate below the gate spacer; forming a recess in the substrate on one side of the gate spacer opposite to the gate structure; and forming an epitaxy feature in the recess of the substrate.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor device and manufacturing method thereof
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