Semiconductor device and manufacturing method thereof

A method includes forming a gate structure on a substrate; forming a gate spacer on a sidewall of the gate structure; forming a carbon-containing layer on the gate spacer; diffusing carbon from the carbon-containing layer into a portion of the substrate below the gate spacer; forming a recess in the...

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Bibliographische Detailangaben
Hauptverfasser: Li, Chung-Ting, Li, Hou-Ju, Lin, Yu-Chang, Chen, Hung-Ming, Lu, Jen-Hsiang, Tsao, Chih-Pin
Format: Patent
Sprache:eng
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Zusammenfassung:A method includes forming a gate structure on a substrate; forming a gate spacer on a sidewall of the gate structure; forming a carbon-containing layer on the gate spacer; diffusing carbon from the carbon-containing layer into a portion of the substrate below the gate spacer; forming a recess in the substrate on one side of the gate spacer opposite to the gate structure; and forming an epitaxy feature in the recess of the substrate.