Methods for establishing thermal joints between heat spreaders or lids and heat sources

According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat be...

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Hauptverfasser: Hill, Richard F, Strader, Jason L
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creator Hill, Richard F
Strader, Jason L
description According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11776868B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11776868B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11776868B23</originalsourceid><addsrcrecordid>eNqNizEOwjAQBN1QIOAPxwMoAlKSGgSioQJEGV2SDTYytuU7xPdJkQdQTTEzc_O4QG3shYaYCaLceifWhSepRX6zp1d0QYVa6BcIZMFKkjK4RxYaL-_GnUM_qfjJHWRpZgN7wWriwqxPx9vhvEGKDSRxhwBt7teiqKqyLuv9dvdP8wOGVzph</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Methods for establishing thermal joints between heat spreaders or lids and heat sources</title><source>esp@cenet</source><creator>Hill, Richard F ; Strader, Jason L</creator><creatorcontrib>Hill, Richard F ; Strader, Jason L</creatorcontrib><description>According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; COMBINED OPERATIONS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; OTHER WORKING OF METAL ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; TRANSPORTING ; UNIVERSAL MACHINE TOOLS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231003&amp;DB=EPODOC&amp;CC=US&amp;NR=11776868B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231003&amp;DB=EPODOC&amp;CC=US&amp;NR=11776868B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Hill, Richard F</creatorcontrib><creatorcontrib>Strader, Jason L</creatorcontrib><title>Methods for establishing thermal joints between heat spreaders or lids and heat sources</title><description>According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>COMBINED OPERATIONS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>OTHER WORKING OF METAL</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><subject>UNIVERSAL MACHINE TOOLS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNizEOwjAQBN1QIOAPxwMoAlKSGgSioQJEGV2SDTYytuU7xPdJkQdQTTEzc_O4QG3shYaYCaLceifWhSepRX6zp1d0QYVa6BcIZMFKkjK4RxYaL-_GnUM_qfjJHWRpZgN7wWriwqxPx9vhvEGKDSRxhwBt7teiqKqyLuv9dvdP8wOGVzph</recordid><startdate>20231003</startdate><enddate>20231003</enddate><creator>Hill, Richard F</creator><creator>Strader, Jason L</creator><scope>EVB</scope></search><sort><creationdate>20231003</creationdate><title>Methods for establishing thermal joints between heat spreaders or lids and heat sources</title><author>Hill, Richard F ; Strader, Jason L</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11776868B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>COMBINED OPERATIONS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>OTHER WORKING OF METAL</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><topic>UNIVERSAL MACHINE TOOLS</topic><toplevel>online_resources</toplevel><creatorcontrib>Hill, Richard F</creatorcontrib><creatorcontrib>Strader, Jason L</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Hill, Richard F</au><au>Strader, Jason L</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Methods for establishing thermal joints between heat spreaders or lids and heat sources</title><date>2023-10-03</date><risdate>2023</risdate><abstract>According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM1) between the heat spreader and the heat source.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
COMBINED OPERATIONS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
OTHER WORKING OF METAL
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
UNIVERSAL MACHINE TOOLS
title Methods for establishing thermal joints between heat spreaders or lids and heat sources
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-22T05%3A03%3A12IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Hill,%20Richard%20F&rft.date=2023-10-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11776868B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true