Corner guard for improved electroplated first level interconnect bump height range

Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment an electronic package comprises a package substrate, and a first level interconnect (FLI) bump region on the package substrate. In an embodiment, the FLI bump region comprises a plurality...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Haehn, Nicholas S, Singh, Antariksh Rao Pratap, Vehonsky, Jacob, Jain, Rahul, Cetegen, Edvin, Cho, Steve S, Heaton, Thomas, Chan Arguedas, Sergio, Ibrahim, Tarek, Neal, Nicholas
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!