Radio-frequency (RF) integrated circuit (IC) (RFIC) packages employing a substrate sidewall partial shield for electro-magnetic interference (EMI) shielding, and related fabrication methods

Radio-frequency (RF) integrated circuit (IC) (RFIC) packages employing a substrate sidewall partial shield for electro-magnetic interference (EMI) shielding. A RFIC package includes an IC die layer that includes a RFIC die(s) mounted on a substrate that includes substrate metallization layers, a sub...

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Bibliographische Detailangaben

Hauptverfasser:	Han, Jeahyeong, Kumar, Rajneesh, Kim, Jeongil Jay, Kim, Chin-Kwan
Format:	Patent
Sprache:	eng
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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