Thermal packaging with fan out wafer level processing

An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, u...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Peternel, Joyce J. M, Prasad, Aparna R, Erickson, Ashley J. M, Razdan, Sandeep, Traverso, Matthew J
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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