Chemical mechanical polishing temperature scanning apparatus for temperature control

Chemical mechanical polishing temperature scanning apparatus for temperature control

A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature monitoring system. The temperature monitoring system includes a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Wu, Haosheng, Soundararajan, Hari, Chang, Shou-Sung, Tang, Jianshe
Format: Patent
Sprache:eng
Schlagworte:
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Wu, Haosheng
Soundararajan, Hari
Chang, Shou-Sung
Tang, Jianshe
description A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature monitoring system. The temperature monitoring system includes a non-contact thermal sensor positioned above the platen that has a field of view of a portion of the polishing pad on the platen. The sensor is rotatable by the motor around an axis of rotation so as to move the field of view across the polishing pad.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11752589B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11752589B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11752589B23</originalsourceid><addsrcrecordid>eNrjZAhxzkjNzUxOzFHITU3OSMwDMwvyczKLMzLz0hVKUnMLUosSS0qLUhWKkxPz8kCCiQUFiSCxYoW0_CIUJcn5eSVF-Tk8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSQ-NNjQ0NzUyNTC0snImBg1ACOwOik</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Chemical mechanical polishing temperature scanning apparatus for temperature control</title><source>esp@cenet</source><creator>Wu, Haosheng ; Soundararajan, Hari ; Chang, Shou-Sung ; Tang, Jianshe</creator><creatorcontrib>Wu, Haosheng ; Soundararajan, Hari ; Chang, Shou-Sung ; Tang, Jianshe</creatorcontrib><description>A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature monitoring system. The temperature monitoring system includes a non-contact thermal sensor positioned above the platen that has a field of view of a portion of the polishing pad on the platen. The sensor is rotatable by the motor around an axis of rotation so as to move the field of view across the polishing pad.</description><language>eng</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230912&amp;DB=EPODOC&amp;CC=US&amp;NR=11752589B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230912&amp;DB=EPODOC&amp;CC=US&amp;NR=11752589B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Wu, Haosheng</creatorcontrib><creatorcontrib>Soundararajan, Hari</creatorcontrib><creatorcontrib>Chang, Shou-Sung</creatorcontrib><creatorcontrib>Tang, Jianshe</creatorcontrib><title>Chemical mechanical polishing temperature scanning apparatus for temperature control</title><description>A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature monitoring system. The temperature monitoring system includes a non-contact thermal sensor positioned above the platen that has a field of view of a portion of the polishing pad on the platen. The sensor is rotatable by the motor around an axis of rotation so as to move the field of view across the polishing pad.</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAhxzkjNzUxOzFHITU3OSMwDMwvyczKLMzLz0hVKUnMLUosSS0qLUhWKkxPz8kCCiQUFiSCxYoW0_CIUJcn5eSVF-Tk8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSQ-NNjQ0NzUyNTC0snImBg1ACOwOik</recordid><startdate>20230912</startdate><enddate>20230912</enddate><creator>Wu, Haosheng</creator><creator>Soundararajan, Hari</creator><creator>Chang, Shou-Sung</creator><creator>Tang, Jianshe</creator><scope>EVB</scope></search><sort><creationdate>20230912</creationdate><title>Chemical mechanical polishing temperature scanning apparatus for temperature control</title><author>Wu, Haosheng ; Soundararajan, Hari ; Chang, Shou-Sung ; Tang, Jianshe</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11752589B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Wu, Haosheng</creatorcontrib><creatorcontrib>Soundararajan, Hari</creatorcontrib><creatorcontrib>Chang, Shou-Sung</creatorcontrib><creatorcontrib>Tang, Jianshe</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Wu, Haosheng</au><au>Soundararajan, Hari</au><au>Chang, Shou-Sung</au><au>Tang, Jianshe</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Chemical mechanical polishing temperature scanning apparatus for temperature control</title><date>2023-09-12</date><risdate>2023</risdate><abstract>A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature monitoring system. The temperature monitoring system includes a non-contact thermal sensor positioned above the platen that has a field of view of a portion of the polishing pad on the platen. The sensor is rotatable by the motor around an axis of rotation so as to move the field of view across the polishing pad.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US11752589B2
source esp@cenet
subjects DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
title Chemical mechanical polishing temperature scanning apparatus for temperature control
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-02T07%3A07%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Wu,%20Haosheng&rft.date=2023-09-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11752589B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true