Thermal structures adapted to electronic device heights in integrated circuit (IC) packages

An IC package includes a heat-generating device and an electrical device on a surface of a substrate, a mold compound disposed on the electrical device, and a thermal structure disposed on the heat-generating device, without the mold compound, to improve heat dissipation. In an example, the thermal...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	We, Hong Bok, Yan, Bohan, Patil, Aniket
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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