Methods and systems for manufacturing pillar structures on semiconductor devices

A method of manufacturing a semiconductor device having a conductive substrate having a first surface, a second surface opposite the first surface, and a passivation material covering a portion of the first surface can include applying a seed layer of conductive material to the first surface of the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Yeruva, Suresh, Jebaraj, Adriel Jebin Jacob, Vadhavkar, Sameer S, Huang, Wayne H, Fay, Owen R
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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