Photonic integrated chip
A photonic integrated chip is configured as a transmitter-receiver chip. The photonic integrated chip includes a light emitter, a light detector, a multi-mode interference coupler, and a mode-filed adapter. The light emitted by the light emitter is guided to a core layer formed below the multi-mode...
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| creator | Koh, Long Cheng Lam, Yee Loy Loh, Ter Hoe Kader, Kamal |
| description | A photonic integrated chip is configured as a transmitter-receiver chip. The photonic integrated chip includes a light emitter, a light detector, a multi-mode interference coupler, and a mode-filed adapter. The light emitted by the light emitter is guided to a core layer formed below the multi-mode interference coupler, and further to the mode-filed adapter for transmission of light to an optical fiber coupled with the photonic integrated chip. Similarly, light received by the mode-filed adapter from the optical fiber propagates to the core layer, and is guided by the multi-mode interference coupler into the light detector. The photonic integrated chip is utilized to realize a single-unit transmitter-receiver module for a fiber optic gyroscope circuit based on monolithic integration of photonics components via wafer fabrication on a substrate. The photonic integrated chip has a low fabrication cost, low size, and is robust. |
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The photonic integrated chip includes a light emitter, a light detector, a multi-mode interference coupler, and a mode-filed adapter. The light emitted by the light emitter is guided to a core layer formed below the multi-mode interference coupler, and further to the mode-filed adapter for transmission of light to an optical fiber coupled with the photonic integrated chip. Similarly, light received by the mode-filed adapter from the optical fiber propagates to the core layer, and is guided by the multi-mode interference coupler into the light detector. The photonic integrated chip is utilized to realize a single-unit transmitter-receiver module for a fiber optic gyroscope circuit based on monolithic integration of photonics components via wafer fabrication on a substrate. 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The photonic integrated chip has a low fabrication cost, low size, and is robust.</description><subject>GYROSCOPIC INSTRUMENTS</subject><subject>MEASURING</subject><subject>MEASURING DISTANCES, LEVELS OR BEARINGS</subject><subject>NAVIGATION</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHOTOGRAMMETRY OR VIDEOGRAMMETRY</subject><subject>PHYSICS</subject><subject>SURVEYING</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAIyMgvyc_LTFbIzCtJTS9KLElNUUjOyCzgYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGhuZGppYmRk5GxsSoAQAAxSKA</recordid><startdate>20230815</startdate><enddate>20230815</enddate><creator>Koh, Long Cheng</creator><creator>Lam, Yee Loy</creator><creator>Loh, Ter Hoe</creator><creator>Kader, Kamal</creator><scope>EVB</scope></search><sort><creationdate>20230815</creationdate><title>Photonic integrated chip</title><author>Koh, Long Cheng ; Lam, Yee Loy ; Loh, Ter Hoe ; Kader, Kamal</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11725942B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>GYROSCOPIC INSTRUMENTS</topic><topic>MEASURING</topic><topic>MEASURING DISTANCES, LEVELS OR BEARINGS</topic><topic>NAVIGATION</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHOTOGRAMMETRY OR VIDEOGRAMMETRY</topic><topic>PHYSICS</topic><topic>SURVEYING</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Koh, Long Cheng</creatorcontrib><creatorcontrib>Lam, Yee Loy</creatorcontrib><creatorcontrib>Loh, Ter Hoe</creatorcontrib><creatorcontrib>Kader, Kamal</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Koh, Long Cheng</au><au>Lam, Yee Loy</au><au>Loh, Ter Hoe</au><au>Kader, Kamal</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Photonic integrated chip</title><date>2023-08-15</date><risdate>2023</risdate><abstract>A photonic integrated chip is configured as a transmitter-receiver chip. The photonic integrated chip includes a light emitter, a light detector, a multi-mode interference coupler, and a mode-filed adapter. The light emitted by the light emitter is guided to a core layer formed below the multi-mode interference coupler, and further to the mode-filed adapter for transmission of light to an optical fiber coupled with the photonic integrated chip. Similarly, light received by the mode-filed adapter from the optical fiber propagates to the core layer, and is guided by the multi-mode interference coupler into the light detector. The photonic integrated chip is utilized to realize a single-unit transmitter-receiver module for a fiber optic gyroscope circuit based on monolithic integration of photonics components via wafer fabrication on a substrate. The photonic integrated chip has a low fabrication cost, low size, and is robust.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | GYROSCOPIC INSTRUMENTS MEASURING MEASURING DISTANCES, LEVELS OR BEARINGS NAVIGATION OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHOTOGRAMMETRY OR VIDEOGRAMMETRY PHYSICS SURVEYING TESTING |
| title | Photonic integrated chip |
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