Three-dimensional memory cell structure

In a semiconductor device, a first stack is positioned over substrate and includes a first pair of transistors and a second pair of transistors stacked over the substrate. A second stack is positioned over the substrate and adjacent to the first stack. The second stack includes a third pair of trans...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Liebmann, Lars, Chanemougame, Daniel, Gutwin, Paul
Format: Patent
Sprache:eng
Schlagworte:
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