Multilayer electronic component
A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin...
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creator | Kim, Kyeong Jun Chun, Jin Sung Shin, Woo Chul Jun, Ho In Kim, Seul Gi |
description | A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin. |
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The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CAPACITORS ; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ; ELECTRICITY</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230808&DB=EPODOC&CC=US&NR=11721480B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230808&DB=EPODOC&CC=US&NR=11721480B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kim, Kyeong Jun</creatorcontrib><creatorcontrib>Chun, Jin Sung</creatorcontrib><creatorcontrib>Shin, Woo Chul</creatorcontrib><creatorcontrib>Jun, Ho In</creatorcontrib><creatorcontrib>Kim, Seul Gi</creatorcontrib><title>Multilayer electronic component</title><description>A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CAPACITORS</subject><subject>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</subject><subject>ELECTRICITY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD3Lc0pycxJrEwtUkjNSU0uKcrPy0xWSM7PLcjPS80r4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8aHBhobmRoYmFgZORsbEqAEAYkMljQ</recordid><startdate>20230808</startdate><enddate>20230808</enddate><creator>Kim, Kyeong Jun</creator><creator>Chun, Jin Sung</creator><creator>Shin, Woo Chul</creator><creator>Jun, Ho In</creator><creator>Kim, Seul Gi</creator><scope>EVB</scope></search><sort><creationdate>20230808</creationdate><title>Multilayer electronic component</title><author>Kim, Kyeong Jun ; Chun, Jin Sung ; Shin, Woo Chul ; Jun, Ho In ; Kim, Seul Gi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11721480B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CAPACITORS</topic><topic>CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE</topic><topic>ELECTRICITY</topic><toplevel>online_resources</toplevel><creatorcontrib>Kim, Kyeong Jun</creatorcontrib><creatorcontrib>Chun, Jin Sung</creatorcontrib><creatorcontrib>Shin, Woo Chul</creatorcontrib><creatorcontrib>Jun, Ho In</creatorcontrib><creatorcontrib>Kim, Seul Gi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kim, Kyeong Jun</au><au>Chun, Jin Sung</au><au>Shin, Woo Chul</au><au>Jun, Ho In</au><au>Kim, Seul Gi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Multilayer electronic component</title><date>2023-08-08</date><risdate>2023</risdate><abstract>A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.</abstract><oa>free_for_read</oa></addata></record> |
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language | eng |
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subjects | BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ELECTRICITY |
title | Multilayer electronic component |
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