Method for fabricating semiconductor package

A method for fabricating a semiconductor package, the method including: forming a release layer on a first carrier substrate, wherein the release layer includes a first portion and a second portion, wherein the first portion has a first thickness, and the second portion has a second thickness thicke...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Park, Jung-Ho, Lee, Seok Hyun, Jang, Jae Gwon, Park, Jin-Woo, Jeon, Gwang Jae
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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