Semiconductor devices and methods for fabricating thereof

Semiconductor device may include a landing pad and a lower electrode that is on and is connected to the landing pad and includes an outer portion and an inner portion inside the outer portion. The outer portion includes first and second regions. The semiconductor devices may also include a dielectri...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Park, Young-Lim, Ahn, Se Hyoung, An, Chang Mu, Kang, Sang Yeol, Seo, Jong-Bom
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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