Inkjet printhead having robust encapsulation of wirebonds
An electronic assembly includes a substrate having a die and PCB mounted thereon. Wirebonds interconnect bond pads of the die with contact pads of the PCB, each wirebond having a first end portion bonded to a respective bond pad, an opposite second end portion bonded to a respective contact pad and...
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| creator | Blanquer, Pascal Webb, Michael John Horrocks, Glenn Tan, See-Huat Coolen, Erik Perez, Elmer Dimaculangan Hossain, Mohammad |
| description | An electronic assembly includes a substrate having a die and PCB mounted thereon. Wirebonds interconnect bond pads of the die with contact pads of the PCB, each wirebond having a first end portion bonded to a respective bond pad, an opposite second end portion bonded to a respective contact pad and an intermediate section extending between the first and second end portions. A dam encapsulant encapsulates each of the first and second end portions, a first fill encapsulant contacts the substrate and the dam encapsulant; and a second fill encapsulant overlies the first fill encapsulant. The first fill encapsulant has a lower modulus of elasticity than the second fill encapsulant and the dam encapsulant. |
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Wirebonds interconnect bond pads of the die with contact pads of the PCB, each wirebond having a first end portion bonded to a respective bond pad, an opposite second end portion bonded to a respective contact pad and an intermediate section extending between the first and second end portions. A dam encapsulant encapsulates each of the first and second end portions, a first fill encapsulant contacts the substrate and the dam encapsulant; and a second fill encapsulant overlies the first fill encapsulant. The first fill encapsulant has a lower modulus of elasticity than the second fill encapsulant and the dam encapsulant.</description><language>eng</language><subject>CORRECTION OF TYPOGRAPHICAL ERRORS ; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME ; LINING MACHINES ; PERFORMING OPERATIONS ; PRINTING ; SELECTIVE PRINTING MECHANISMS ; STAMPS ; TRANSPORTING ; TYPEWRITERS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230718&DB=EPODOC&CC=US&NR=11701883B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230718&DB=EPODOC&CC=US&NR=11701883B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Blanquer, Pascal</creatorcontrib><creatorcontrib>Webb, Michael John</creatorcontrib><creatorcontrib>Horrocks, Glenn</creatorcontrib><creatorcontrib>Tan, See-Huat</creatorcontrib><creatorcontrib>Coolen, Erik</creatorcontrib><creatorcontrib>Perez, Elmer Dimaculangan</creatorcontrib><creatorcontrib>Hossain, Mohammad</creatorcontrib><title>Inkjet printhead having robust encapsulation of wirebonds</title><description>An electronic assembly includes a substrate having a die and PCB mounted thereon. Wirebonds interconnect bond pads of the die with contact pads of the PCB, each wirebond having a first end portion bonded to a respective bond pad, an opposite second end portion bonded to a respective contact pad and an intermediate section extending between the first and second end portions. A dam encapsulant encapsulates each of the first and second end portions, a first fill encapsulant contacts the substrate and the dam encapsulant; and a second fill encapsulant overlies the first fill encapsulant. The first fill encapsulant has a lower modulus of elasticity than the second fill encapsulant and the dam encapsulant.</description><subject>CORRECTION OF TYPOGRAPHICAL ERRORS</subject><subject>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</subject><subject>LINING MACHINES</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTING</subject><subject>SELECTIVE PRINTING MECHANISMS</subject><subject>STAMPS</subject><subject>TRANSPORTING</subject><subject>TYPEWRITERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD0zMvOSi1RKCjKzCvJSE1MUchILMvMS1coyk8qLS5RSM1LTiwoLs1JLMnMz1PIT1MozyxKTcrPSynmYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGhuYGhhYWxk5GxsSoAQCDVS9m</recordid><startdate>20230718</startdate><enddate>20230718</enddate><creator>Blanquer, Pascal</creator><creator>Webb, Michael John</creator><creator>Horrocks, Glenn</creator><creator>Tan, See-Huat</creator><creator>Coolen, Erik</creator><creator>Perez, Elmer Dimaculangan</creator><creator>Hossain, Mohammad</creator><scope>EVB</scope></search><sort><creationdate>20230718</creationdate><title>Inkjet printhead having robust encapsulation of wirebonds</title><author>Blanquer, Pascal ; Webb, Michael John ; Horrocks, Glenn ; Tan, See-Huat ; Coolen, Erik ; Perez, Elmer Dimaculangan ; Hossain, Mohammad</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11701883B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>CORRECTION OF TYPOGRAPHICAL ERRORS</topic><topic>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</topic><topic>LINING MACHINES</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTING</topic><topic>SELECTIVE PRINTING MECHANISMS</topic><topic>STAMPS</topic><topic>TRANSPORTING</topic><topic>TYPEWRITERS</topic><toplevel>online_resources</toplevel><creatorcontrib>Blanquer, Pascal</creatorcontrib><creatorcontrib>Webb, Michael John</creatorcontrib><creatorcontrib>Horrocks, Glenn</creatorcontrib><creatorcontrib>Tan, See-Huat</creatorcontrib><creatorcontrib>Coolen, Erik</creatorcontrib><creatorcontrib>Perez, Elmer Dimaculangan</creatorcontrib><creatorcontrib>Hossain, Mohammad</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Blanquer, Pascal</au><au>Webb, Michael John</au><au>Horrocks, Glenn</au><au>Tan, See-Huat</au><au>Coolen, Erik</au><au>Perez, Elmer Dimaculangan</au><au>Hossain, Mohammad</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Inkjet printhead having robust encapsulation of wirebonds</title><date>2023-07-18</date><risdate>2023</risdate><abstract>An electronic assembly includes a substrate having a die and PCB mounted thereon. Wirebonds interconnect bond pads of the die with contact pads of the PCB, each wirebond having a first end portion bonded to a respective bond pad, an opposite second end portion bonded to a respective contact pad and an intermediate section extending between the first and second end portions. A dam encapsulant encapsulates each of the first and second end portions, a first fill encapsulant contacts the substrate and the dam encapsulant; and a second fill encapsulant overlies the first fill encapsulant. The first fill encapsulant has a lower modulus of elasticity than the second fill encapsulant and the dam encapsulant.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CORRECTION OF TYPOGRAPHICAL ERRORS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS |
| title | Inkjet printhead having robust encapsulation of wirebonds |
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