Three-dimensional thermistor platform and a method for manufacturing the same

A three-dimensional thermistor device and a manufacturing method thereof. The three-dimensional thermistor device comprising a thermistor array formed on a base layer extending in first and second directions. Where the thermistor array comprises: thermistor pattern layers and insulating layers stack...

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Hauptverfasser: Krotosky, Jeffrey, Cai, Zhihua
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Cai, Zhihua
description A three-dimensional thermistor device and a manufacturing method thereof. The three-dimensional thermistor device comprising a thermistor array formed on a base layer extending in first and second directions. Where the thermistor array comprises: thermistor pattern layers and insulating layers stacked alternately on the base layer in a third direction; each thermistor pattern layer including a continuous electrically conductive first trace disposed along a first path extending in both the first and second directions, and each insulating layer including an electrically conductive first via extending through the insulating layer in the third direction to electrically connect the first traces to each other. Where successive electrical connections between the respective first vias on the stacked insulating layers and the respective first traces on the stacked thermistor layers form a continuous electrical first thermistor element extending in the first, second and third directions across multiple of the thermistor pattern layers.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11699539B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11699539B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11699539B23</originalsourceid><addsrcrecordid>eNqNi0EKwjAQAHPxIOof1gf0UItCrxXFiyfruSzNxgSym5Bs_6-CD_A0MMyszX30haixgUlqSIIR1FPhUDUVyBHVpcKAYgGBSX2y8DHAKIvDWZcS5PVdoCLT1qwcxkq7Hzdmf72M51tDOU1UM84kpNPz0banvj92_XDo_mneExY2ww</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Three-dimensional thermistor platform and a method for manufacturing the same</title><source>esp@cenet</source><creator>Krotosky, Jeffrey ; Cai, Zhihua</creator><creatorcontrib>Krotosky, Jeffrey ; Cai, Zhihua</creatorcontrib><description>A three-dimensional thermistor device and a manufacturing method thereof. The three-dimensional thermistor device comprising a thermistor array formed on a base layer extending in first and second directions. Where the thermistor array comprises: thermistor pattern layers and insulating layers stacked alternately on the base layer in a third direction; each thermistor pattern layer including a continuous electrically conductive first trace disposed along a first path extending in both the first and second directions, and each insulating layer including an electrically conductive first via extending through the insulating layer in the third direction to electrically connect the first traces to each other. Where successive electrical connections between the respective first vias on the stacked insulating layers and the respective first traces on the stacked thermistor layers form a continuous electrical first thermistor element extending in the first, second and third directions across multiple of the thermistor pattern layers.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRICITY ; RESISTORS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230711&amp;DB=EPODOC&amp;CC=US&amp;NR=11699539B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230711&amp;DB=EPODOC&amp;CC=US&amp;NR=11699539B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Krotosky, Jeffrey</creatorcontrib><creatorcontrib>Cai, Zhihua</creatorcontrib><title>Three-dimensional thermistor platform and a method for manufacturing the same</title><description>A three-dimensional thermistor device and a manufacturing method thereof. The three-dimensional thermistor device comprising a thermistor array formed on a base layer extending in first and second directions. Where the thermistor array comprises: thermistor pattern layers and insulating layers stacked alternately on the base layer in a third direction; each thermistor pattern layer including a continuous electrically conductive first trace disposed along a first path extending in both the first and second directions, and each insulating layer including an electrically conductive first via extending through the insulating layer in the third direction to electrically connect the first traces to each other. Where successive electrical connections between the respective first vias on the stacked insulating layers and the respective first traces on the stacked thermistor layers form a continuous electrical first thermistor element extending in the first, second and third directions across multiple of the thermistor pattern layers.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRICITY</subject><subject>RESISTORS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi0EKwjAQAHPxIOof1gf0UItCrxXFiyfruSzNxgSym5Bs_6-CD_A0MMyszX30haixgUlqSIIR1FPhUDUVyBHVpcKAYgGBSX2y8DHAKIvDWZcS5PVdoCLT1qwcxkq7Hzdmf72M51tDOU1UM84kpNPz0banvj92_XDo_mneExY2ww</recordid><startdate>20230711</startdate><enddate>20230711</enddate><creator>Krotosky, Jeffrey</creator><creator>Cai, Zhihua</creator><scope>EVB</scope></search><sort><creationdate>20230711</creationdate><title>Three-dimensional thermistor platform and a method for manufacturing the same</title><author>Krotosky, Jeffrey ; Cai, Zhihua</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11699539B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRICITY</topic><topic>RESISTORS</topic><toplevel>online_resources</toplevel><creatorcontrib>Krotosky, Jeffrey</creatorcontrib><creatorcontrib>Cai, Zhihua</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Krotosky, Jeffrey</au><au>Cai, Zhihua</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Three-dimensional thermistor platform and a method for manufacturing the same</title><date>2023-07-11</date><risdate>2023</risdate><abstract>A three-dimensional thermistor device and a manufacturing method thereof. The three-dimensional thermistor device comprising a thermistor array formed on a base layer extending in first and second directions. Where the thermistor array comprises: thermistor pattern layers and insulating layers stacked alternately on the base layer in a third direction; each thermistor pattern layer including a continuous electrically conductive first trace disposed along a first path extending in both the first and second directions, and each insulating layer including an electrically conductive first via extending through the insulating layer in the third direction to electrically connect the first traces to each other. Where successive electrical connections between the respective first vias on the stacked insulating layers and the respective first traces on the stacked thermistor layers form a continuous electrical first thermistor element extending in the first, second and third directions across multiple of the thermistor pattern layers.</abstract><oa>free_for_read</oa></addata></record>
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ELECTRICITY
RESISTORS
title Three-dimensional thermistor platform and a method for manufacturing the same
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-31T03%3A47%3A17IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Krotosky,%20Jeffrey&rft.date=2023-07-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11699539B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true