Semiconductor devices having a plurality of offsets in leads supporting stacked components and methods of manufacturing thereof

In one example, a semiconductor device includes a substrate having leads that include lead terminals, lead steps, and lead offsets extending between the lead steps so that at least some lead steps reside on different planes. A first electronic component is coupled to a first lead step side and inclu...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Bae, Jae Min, Cho, Hyung Jun, Lee, Seung Woo
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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