Cryogenic wafer test system
One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of supercondu...
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| creator | Osborne, Joshua P Van Dyke, Jonathan Francis Wakamiya, Stanley Katsuyoshi Collao, Kevin Sage, Tessandra Anne |
| description | One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes at least one wafer prober configured to implement a test on a superconducting die of the plurality of superconducting die via a plurality of electrical probe contacts. The system further includes a wafer chuck actuator system confined within a second chamber. The wafer chuck actuator system can be configured to provide at least one of translational and rotational motion of the wafer chuck to facilitate alignment and contact of a plurality of electrical contacts of the superconducting die to the respective plurality of electrical probe contacts of the at least one wafer prober. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11693047B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11693047B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11693047B23</originalsourceid><addsrcrecordid>eNrjZJB2LqrMT0_Ny0xWKE9MSy1SKEktLlEoriwuSc3lYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGhmaWxgYm5k5GxsSoAQCGdiOx</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Cryogenic wafer test system</title><source>esp@cenet</source><creator>Osborne, Joshua P ; Van Dyke, Jonathan Francis ; Wakamiya, Stanley Katsuyoshi ; Collao, Kevin ; Sage, Tessandra Anne</creator><creatorcontrib>Osborne, Joshua P ; Van Dyke, Jonathan Francis ; Wakamiya, Stanley Katsuyoshi ; Collao, Kevin ; Sage, Tessandra Anne</creatorcontrib><description>One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes at least one wafer prober configured to implement a test on a superconducting die of the plurality of superconducting die via a plurality of electrical probe contacts. The system further includes a wafer chuck actuator system confined within a second chamber. The wafer chuck actuator system can be configured to provide at least one of translational and rotational motion of the wafer chuck to facilitate alignment and contact of a plurality of electrical contacts of the superconducting die to the respective plurality of electrical probe contacts of the at least one wafer prober.</description><language>eng</language><subject>MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; TESTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230704&DB=EPODOC&CC=US&NR=11693047B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230704&DB=EPODOC&CC=US&NR=11693047B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Osborne, Joshua P</creatorcontrib><creatorcontrib>Van Dyke, Jonathan Francis</creatorcontrib><creatorcontrib>Wakamiya, Stanley Katsuyoshi</creatorcontrib><creatorcontrib>Collao, Kevin</creatorcontrib><creatorcontrib>Sage, Tessandra Anne</creatorcontrib><title>Cryogenic wafer test system</title><description>One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes at least one wafer prober configured to implement a test on a superconducting die of the plurality of superconducting die via a plurality of electrical probe contacts. The system further includes a wafer chuck actuator system confined within a second chamber. The wafer chuck actuator system can be configured to provide at least one of translational and rotational motion of the wafer chuck to facilitate alignment and contact of a plurality of electrical contacts of the superconducting die to the respective plurality of electrical probe contacts of the at least one wafer prober.</description><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB2LqrMT0_Ny0xWKE9MSy1SKEktLlEoriwuSc3lYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGhmaWxgYm5k5GxsSoAQCGdiOx</recordid><startdate>20230704</startdate><enddate>20230704</enddate><creator>Osborne, Joshua P</creator><creator>Van Dyke, Jonathan Francis</creator><creator>Wakamiya, Stanley Katsuyoshi</creator><creator>Collao, Kevin</creator><creator>Sage, Tessandra Anne</creator><scope>EVB</scope></search><sort><creationdate>20230704</creationdate><title>Cryogenic wafer test system</title><author>Osborne, Joshua P ; Van Dyke, Jonathan Francis ; Wakamiya, Stanley Katsuyoshi ; Collao, Kevin ; Sage, Tessandra Anne</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11693047B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Osborne, Joshua P</creatorcontrib><creatorcontrib>Van Dyke, Jonathan Francis</creatorcontrib><creatorcontrib>Wakamiya, Stanley Katsuyoshi</creatorcontrib><creatorcontrib>Collao, Kevin</creatorcontrib><creatorcontrib>Sage, Tessandra Anne</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Osborne, Joshua P</au><au>Van Dyke, Jonathan Francis</au><au>Wakamiya, Stanley Katsuyoshi</au><au>Collao, Kevin</au><au>Sage, Tessandra Anne</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Cryogenic wafer test system</title><date>2023-07-04</date><risdate>2023</risdate><abstract>One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes at least one wafer prober configured to implement a test on a superconducting die of the plurality of superconducting die via a plurality of electrical probe contacts. The system further includes a wafer chuck actuator system confined within a second chamber. The wafer chuck actuator system can be configured to provide at least one of translational and rotational motion of the wafer chuck to facilitate alignment and contact of a plurality of electrical contacts of the superconducting die to the respective plurality of electrical probe contacts of the at least one wafer prober.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING |
| title | Cryogenic wafer test system |
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