Thermal management for thermal cyclers using air tubes

Thermal management for thermal cyclers using air tubes

A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of t...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Culinco, Gabriel, Sadri, Amir, Nikolic, Neven, Kircanski, Nenad, Tran, Thanh-Vi
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Culinco, Gabriel
Sadri, Amir
Nikolic, Neven
Kircanski, Nenad
Tran, Thanh-Vi
description A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11690169B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11690169B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11690169B23</originalsourceid><addsrcrecordid>eNrjZDALyUgtyk3MUchNzEtMT81NzStRSMsvUiiBCidXJuekFhUrlBZn5qUrJGYCZUqTUot5GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqcUFicmpeakl8aLChoZmlARA7GRkTowYAqjEtyw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Thermal management for thermal cyclers using air tubes</title><source>esp@cenet</source><creator>Culinco, Gabriel ; Sadri, Amir ; Nikolic, Neven ; Kircanski, Nenad ; Tran, Thanh-Vi</creator><creatorcontrib>Culinco, Gabriel ; Sadri, Amir ; Nikolic, Neven ; Kircanski, Nenad ; Tran, Thanh-Vi</creatorcontrib><description>A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230627&amp;DB=EPODOC&amp;CC=US&amp;NR=11690169B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230627&amp;DB=EPODOC&amp;CC=US&amp;NR=11690169B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Culinco, Gabriel</creatorcontrib><creatorcontrib>Sadri, Amir</creatorcontrib><creatorcontrib>Nikolic, Neven</creatorcontrib><creatorcontrib>Kircanski, Nenad</creatorcontrib><creatorcontrib>Tran, Thanh-Vi</creatorcontrib><title>Thermal management for thermal cyclers using air tubes</title><description>A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDALyUgtyk3MUchNzEtMT81NzStRSMsvUiiBCidXJuekFhUrlBZn5qUrJGYCZUqTUot5GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqcUFicmpeakl8aLChoZmlARA7GRkTowYAqjEtyw</recordid><startdate>20230627</startdate><enddate>20230627</enddate><creator>Culinco, Gabriel</creator><creator>Sadri, Amir</creator><creator>Nikolic, Neven</creator><creator>Kircanski, Nenad</creator><creator>Tran, Thanh-Vi</creator><scope>EVB</scope></search><sort><creationdate>20230627</creationdate><title>Thermal management for thermal cyclers using air tubes</title><author>Culinco, Gabriel ; Sadri, Amir ; Nikolic, Neven ; Kircanski, Nenad ; Tran, Thanh-Vi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11690169B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Culinco, Gabriel</creatorcontrib><creatorcontrib>Sadri, Amir</creatorcontrib><creatorcontrib>Nikolic, Neven</creatorcontrib><creatorcontrib>Kircanski, Nenad</creatorcontrib><creatorcontrib>Tran, Thanh-Vi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Culinco, Gabriel</au><au>Sadri, Amir</au><au>Nikolic, Neven</au><au>Kircanski, Nenad</au><au>Tran, Thanh-Vi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Thermal management for thermal cyclers using air tubes</title><date>2023-06-27</date><risdate>2023</risdate><abstract>A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US11690169B2
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Thermal management for thermal cyclers using air tubes
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-28T04%3A43%3A12IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Culinco,%20Gabriel&rft.date=2023-06-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11690169B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true