Passivation layer for integrated circuit structure and forming the same

An integrated circuit (IC) structure includes a substrate, a transistor, an interconnect structure, a plurality of metal lines, an oxide liner, a passivation layer, and a nitride layer. The transistor is on the substrate. The interconnect structure is over the transistor. The metal lines is on the i...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Wang, Chih-Pin, Chen, Chun-Chiang, Wu, Chun-Ting, Su, Ching-Hou
Format: Patent
Sprache:eng
Schlagworte:
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