Hyperbaric saw for sawing packaged devices

In a described example, an apparatus includes: a process chamber configured for a pressure greater than one atmosphere, having a device chuck configured to support electronic devices that are mounted on package substrates and partially covered in mold compound, the electronic devices spaced from one...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Gibbs, Byron Harry, Wyant, Michael Todd
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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