Semiconductor package element

A semiconductor package element includes a die, a passive layer, a conductive structure and an encapsulation layer. The die includes a first surface, a second surface and a third surface. The second surface is opposite to the first surface. The third surface is connected between the first surface an...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Li, Chi-Hsueh, Ho, Chung-Hsiung, Chang, Chih-Hung
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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