Contactless wafer separator

The present disclosure is directed to a wafer container including: a housing configured for transporting a plurality of wafers, wherein the plurality of wafers are stacked on a base of the housing in a first direction; a plurality of wafer separator rings; each of the wafer separator rings configure...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Wong, Shaw Fong, Dhruvkumar, Varshalaxmi Bhatt, Biggs, John
Format: Patent
Sprache:eng
Schlagworte:
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