Contactless wafer separator
The present disclosure is directed to a wafer container including: a housing configured for transporting a plurality of wafers, wherein the plurality of wafers are stacked on a base of the housing in a first direction; a plurality of wafer separator rings; each of the wafer separator rings configure...
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| creator | Wong, Shaw Fong Dhruvkumar, Varshalaxmi Bhatt Biggs, John |
| description | The present disclosure is directed to a wafer container including: a housing configured for transporting a plurality of wafers, wherein the plurality of wafers are stacked on a base of the housing in a first direction; a plurality of wafer separator rings; each of the wafer separator rings configured to encircle a wafer of the plurality of wafers in a second direction that is substantially perpendicular to the first direction, each of the wafer separator rings including a top surface and a bottom surface, defining a thickness there between extending in the first direction, which is about 0.3 mm-1.4 mm; and each of the wafer separator rings including an inner side wall and an outer side wall defined by an inner diameter and an outer diameter, respectively, in the second direction, wherein the inner diameter of the wafer separator ring is greater than 300 mm and configured to be spaced apart from the wafer it is encircling. |
| format | Patent |
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a plurality of wafer separator rings; each of the wafer separator rings configured to encircle a wafer of the plurality of wafers in a second direction that is substantially perpendicular to the first direction, each of the wafer separator rings including a top surface and a bottom surface, defining a thickness there between extending in the first direction, which is about 0.3 mm-1.4 mm; and each of the wafer separator rings including an inner side wall and an outer side wall defined by an inner diameter and an outer diameter, respectively, in the second direction, wherein the inner diameter of the wafer separator ring is greater than 300 mm and configured to be spaced apart from the wafer it is encircling.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CONVEYING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HANDLING THIN OR FILAMENTARY MATERIAL ; PACKING ; PERFORMING OPERATIONS ; PNEUMATIC TUBE CONVEYORS ; SEMICONDUCTOR DEVICES ; SHOP CONVEYOR SYSTEMS ; 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a plurality of wafer separator rings; each of the wafer separator rings configured to encircle a wafer of the plurality of wafers in a second direction that is substantially perpendicular to the first direction, each of the wafer separator rings including a top surface and a bottom surface, defining a thickness there between extending in the first direction, which is about 0.3 mm-1.4 mm; and each of the wafer separator rings including an inner side wall and an outer side wall defined by an inner diameter and an outer diameter, respectively, in the second direction, wherein the inner diameter of the wafer separator ring is greater than 300 mm and configured to be spaced apart from the wafer it is encircling.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING |
| title | Contactless wafer separator |
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