Thermoelectric cooler systems for thermal enhancement in immersion cooling and associated methods thereof
Thermoelectric cooler systems for thermal enhancement in immersion cooling and associated methods thereof are disclosed. According to an aspect, a system includes a liquid vessel that defines an interior space for holding a cooling liquid and an electronic component. The system also includes a heat...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Kamath, Vinod Artman, Paul Holland, Jeffrey |
| description | Thermoelectric cooler systems for thermal enhancement in immersion cooling and associated methods thereof are disclosed. According to an aspect, a system includes a liquid vessel that defines an interior space for holding a cooling liquid and an electronic component. The system also includes a heat conduit including a first portion, a second portion, and a third portion. The heat conduit is configured to transfer heat between the portions. Further, the first portion is configured to transfer heat from the electronic component to the second portion. The second portion is configured to transfer heat to the cooling liquid and to the third portion. The system includes a thermoelectric cooler positioned within the interior space. The thermoelectric cooler includes an absorption side and a rejection side. The thermoelectric cooler is configured to transfer heat from the absorption side to the rejection side. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11656006B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11656006B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11656006B23</originalsourceid><addsrcrecordid>eNqNyzEKwkAQRuE0FqLeYTyAkCjmAIpib6zDsPljFnZnws403l4UD2D1mu8tq9hNKFmRELzEQEE1oZC9zJGNRi3kH8GJIBNLQIY4RaGYM4pFle8T5UksA7GZhsiOgTJ80sG-P3RcV4uRk2Hz66raXi_d-bbDrD1s5gCB949707THtq7b0_7wj3kD4ZdBzw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Thermoelectric cooler systems for thermal enhancement in immersion cooling and associated methods thereof</title><source>esp@cenet</source><creator>Kamath, Vinod ; Artman, Paul ; Holland, Jeffrey</creator><creatorcontrib>Kamath, Vinod ; Artman, Paul ; Holland, Jeffrey</creatorcontrib><description>Thermoelectric cooler systems for thermal enhancement in immersion cooling and associated methods thereof are disclosed. According to an aspect, a system includes a liquid vessel that defines an interior space for holding a cooling liquid and an electronic component. The system also includes a heat conduit including a first portion, a second portion, and a third portion. The heat conduit is configured to transfer heat between the portions. Further, the first portion is configured to transfer heat from the electronic component to the second portion. The second portion is configured to transfer heat to the cooling liquid and to the third portion. The system includes a thermoelectric cooler positioned within the interior space. The thermoelectric cooler includes an absorption side and a rejection side. The thermoelectric cooler is configured to transfer heat from the absorption side to the rejection side.</description><language>eng</language><subject>BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMBINED HEATING AND REFRIGERATION SYSTEMS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT PUMP SYSTEMS ; HEATING ; LIGHTING ; LIQUEFACTION SOLIDIFICATION OF GASES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MANUFACTURE OR STORAGE OF ICE ; MECHANICAL ENGINEERING ; PRINTED CIRCUITS ; REFRIGERATION MACHINES, PLANTS OR SYSTEMS ; REFRIGERATION OR COOLING ; WEAPONS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230523&DB=EPODOC&CC=US&NR=11656006B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230523&DB=EPODOC&CC=US&NR=11656006B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kamath, Vinod</creatorcontrib><creatorcontrib>Artman, Paul</creatorcontrib><creatorcontrib>Holland, Jeffrey</creatorcontrib><title>Thermoelectric cooler systems for thermal enhancement in immersion cooling and associated methods thereof</title><description>Thermoelectric cooler systems for thermal enhancement in immersion cooling and associated methods thereof are disclosed. According to an aspect, a system includes a liquid vessel that defines an interior space for holding a cooling liquid and an electronic component. The system also includes a heat conduit including a first portion, a second portion, and a third portion. The heat conduit is configured to transfer heat between the portions. Further, the first portion is configured to transfer heat from the electronic component to the second portion. The second portion is configured to transfer heat to the cooling liquid and to the third portion. The system includes a thermoelectric cooler positioned within the interior space. The thermoelectric cooler includes an absorption side and a rejection side. The thermoelectric cooler is configured to transfer heat from the absorption side to the rejection side.</description><subject>BLASTING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMBINED HEATING AND REFRIGERATION SYSTEMS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT PUMP SYSTEMS</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>LIQUEFACTION SOLIDIFICATION OF GASES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MANUFACTURE OR STORAGE OF ICE</subject><subject>MECHANICAL ENGINEERING</subject><subject>PRINTED CIRCUITS</subject><subject>REFRIGERATION MACHINES, PLANTS OR SYSTEMS</subject><subject>REFRIGERATION OR COOLING</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyzEKwkAQRuE0FqLeYTyAkCjmAIpib6zDsPljFnZnws403l4UD2D1mu8tq9hNKFmRELzEQEE1oZC9zJGNRi3kH8GJIBNLQIY4RaGYM4pFle8T5UksA7GZhsiOgTJ80sG-P3RcV4uRk2Hz66raXi_d-bbDrD1s5gCB949707THtq7b0_7wj3kD4ZdBzw</recordid><startdate>20230523</startdate><enddate>20230523</enddate><creator>Kamath, Vinod</creator><creator>Artman, Paul</creator><creator>Holland, Jeffrey</creator><scope>EVB</scope></search><sort><creationdate>20230523</creationdate><title>Thermoelectric cooler systems for thermal enhancement in immersion cooling and associated methods thereof</title><author>Kamath, Vinod ; Artman, Paul ; Holland, Jeffrey</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11656006B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>BLASTING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMBINED HEATING AND REFRIGERATION SYSTEMS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT PUMP SYSTEMS</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>LIQUEFACTION SOLIDIFICATION OF GASES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MANUFACTURE OR STORAGE OF ICE</topic><topic>MECHANICAL ENGINEERING</topic><topic>PRINTED CIRCUITS</topic><topic>REFRIGERATION MACHINES, PLANTS OR SYSTEMS</topic><topic>REFRIGERATION OR COOLING</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>Kamath, Vinod</creatorcontrib><creatorcontrib>Artman, Paul</creatorcontrib><creatorcontrib>Holland, Jeffrey</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kamath, Vinod</au><au>Artman, Paul</au><au>Holland, Jeffrey</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Thermoelectric cooler systems for thermal enhancement in immersion cooling and associated methods thereof</title><date>2023-05-23</date><risdate>2023</risdate><abstract>Thermoelectric cooler systems for thermal enhancement in immersion cooling and associated methods thereof are disclosed. According to an aspect, a system includes a liquid vessel that defines an interior space for holding a cooling liquid and an electronic component. The system also includes a heat conduit including a first portion, a second portion, and a third portion. The heat conduit is configured to transfer heat between the portions. Further, the first portion is configured to transfer heat from the electronic component to the second portion. The second portion is configured to transfer heat to the cooling liquid and to the third portion. The system includes a thermoelectric cooler positioned within the interior space. The thermoelectric cooler includes an absorption side and a rejection side. The thermoelectric cooler is configured to transfer heat from the absorption side to the rejection side.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US11656006B2 |
| source | esp@cenet |
| subjects | BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMBINED HEATING AND REFRIGERATION SYSTEMS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT PUMP SYSTEMS HEATING LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING PRINTED CIRCUITS REFRIGERATION MACHINES, PLANTS OR SYSTEMS REFRIGERATION OR COOLING WEAPONS |
| title | Thermoelectric cooler systems for thermal enhancement in immersion cooling and associated methods thereof |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-17T21%3A14%3A33IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Kamath,%20Vinod&rft.date=2023-05-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11656006B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |